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1 . Academic Journal
Biodegradable triboelectric nanogenerator as a implantable power source for embedded medicine devices
저자
by
Gang Jian
;
Shangtao Zhu
;
Xiao Yuan
;
Shengqiao Fu
;
Ning Yang
, et al.
소스
NPG Asia Materials, Vol 16, Iss 1, Pp 1-11 (2024)
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7 . Conference
Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation
저자
by
Sun, Zhijian
;
Yu, Michael
;
Li, Jiaxiong
;
Moran, Macleary
;
Kathaperumal, Mohanalingam
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1282-1286 May, 2022
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7 . Conference
Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint
저자
by
Li, Jiaxiong
;
Wilson, John
;
Cheung, Dylan
;
Sun, Zhijian
;
Moon, Kyoung-Sik
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2018-2023 May, 2022
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7 . Academic Journal
High-performance stretchable flexible supercapacitor based on lignosulfonate/Prussian blue analogous nanohybrids reinforced rubber by direct laser writing
저자
by
Wang, Zuhao
;
Huang, Zhaoyan
;
Yu, Peng
;
Wong, Ching-ping
;
Jiang, Can
.
소스
In
Chemical Engineering Journal
15 April 2024 486
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7 . Academic Journal
Investigation of Na7V3(P2O7)4/carbon composite as cathode material for sodium-ion battery: Influences of carbon additives and voltage windows
저자
by
Xie, Fuqiang
;
Chen, Jizhang
;
Xu, Junling
;
Zheng, Mingchuan
;
Dong, Yifan
, et al.
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In
Journal of Energy Storage
30 January 2024 77
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7 . Academic Journal
Advances in fabric-based supercapacitors and batteries: Harnessing textiles for next-generation energy storage
저자
by
Hong, Hong
;
Tu, Huating
;
Jiang, Lihong
;
Du, Yong
;
Wong, Ching-ping
.
소스
In
Journal of Energy Storage
1 January 2024 75
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7 . Conference
The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip Package
저자
by
Jiang, Ruoyu
;
Zhonz, Cheng
;
Wang, Haozhe
;
Li, Chenglong
;
Zheng, Yi
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021
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7 . Conference
Characterization and Verification of Viscoelastic Constitutive Parameters of Underfill Material
저자
by
Zhong, Cheng
;
Li, Chenglong
;
Lu, Lu
;
Wang, Yunxia
;
Li, Gang
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021
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7 . Conference
Viscoelastic Characterization and Simulation of Thermal Interface Materials
저자
by
Zhong, Cheng
;
Li, Chenglong
;
Wang, Yunxia
;
Lu, Jibao
;
Ren, Linlin
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021
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7 . Conference
Numerical analysis on the effect of microstructures on the thermal and mechanical properties of carbon fiber / Al2O3 thermal pad
저자
by
Liu, Shu
;
Lu, Xiaoxin
;
Huang, Jiabin
;
Lu, Jibao
;
Xu, Shen
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021
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